Surface morphology analysis of copper films produced by anodizing process
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Date
2020-08
Authors
Kadir, Meruyert
Alpysbayeva, Balaussa
Smirnov, Vladimir
Journal Title
Journal ISSN
Volume Title
Publisher
The 8th International Conference on Nanomaterials and Advanced Energy Storage Systems; Nazarbayev University; National Laboratory Astana; Institute of Batteries
Abstract
Currently, copper oxide films are of interest to researchers due to their environmental friendliness, rich resources and low cost. Copper oxide is a p-type semiconductor with a narrow band (1.9 eV-2.2 eV). This material is characterized by the possibility of effective application in sensors [1], hydrogen production [2], energy conversion [3], for the creation of supercapacitors [4], semiconductor catalysis [5], biosensorics [6]. The anodizing process allows you to obtain porous materials based on metal oxides. As with aluminum and titanium oxides, the anodizing process can produce a porous material based on copper oxide. Anodizing is a low-temperature, versatile, economical and simple method. In addition, anodizing allows to change the morphology and size of the copper oxide nanostructure to some extent [7]. In the course of practical work, a copper plate with a size of several microns was used as the initial material. The process of single-stage anodizing was performed at a temperature of 4°C for 90 seconds in an electrolyte of an acidic environment. As a result, the morphology of copper films was studied using Ntegra Therma (NT - MDT) atomic force microscopy. AFM shows that the surface morphology depends on various chemical bonds on the surface of copper.
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Keywords
copper films, anodizing process, Research Subject Categories::TECHNOLOGY